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Advanced Thin Film Coating for Electroplating Metals

Date Posted:

Jet Process Corporation
North Haven, CT 06473

Conventional processes used to apply thin film coatings on electric devices generate significant water pollution, process waste, and toxic effluent.  The most common coating processes—sputtering, evaporation, Chemical Vapor Deposition, and electroplating — are not always compatible with heat sensitive substrates and semiconductor processes, and they provide only moderate output at a high cost. Jet Process Corporation has developed an innovative, carbon-free process without toxic precursors or effluents to manufacture high-quality coatings on substrates for various applications. The Jet Vapor DepositionTM (JVDTM) process can use various metal sources, including gold, chromium, nickel, copper, zinc, iron, tin, and silver; and, the resultant coatings are equivalent or superior to conventional coatings, environmentally friendly, and more cost effective.  The company specializes in deposition of gold-tin and other lead-free solders.  The process allows easy sequential or simultaneous deposition of multiple metal components, enabling a reproducible combination of complex layers and alloys.  JVDTM coatings are used by leading manufacturers of microelectronics, semiconductor packaging, advanced sensors, solid state lighting, optoelectronics, telecommunications, and MEMs components.  The company holds more than 30 U.S. and foreign patents and provides high-quality coatings for diverse industrial, consumer, and military applications.

Read more: http://www.epa.gov/ncer/sbir/success/pdf/jetprocess.pdf

 

Funding Agency

Department of Defense

Jet Process Corporation

CT
United States

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